3D Glass Solutions, Inc. (3DGS) is focused on the fabrication of RF and Microwave electronic systems and devices using photo-definable glass-ceramics.

3D Glass Solutions, Inc. (3DGS), the world’s leading manufacturer of glass-based system-in-chip (SiP) and integrated passive devices (IPDs) for radio frequency (RF) and Internet of Things (IoT) applications, is pleased to announce the most recent patent to our growing portfolio that protects components and systems for the 5G, Millimeter Wave, Microwave and High-Speed Data Communications markets.

3DGS is a private late-stage high-tech manufacturing business headquartered in Albuquerque, New Mexico. 3DGS manufactures a wide variety of glass-based system-in-package (SiP) devices and components using its patented low-loss photosensitive APEX® Glass technology for applications in radio-frequency (RF) electronics, photonics, automotive radar, integrated circuit (IC) electronics, medical, aerospace, defense, wireless infrastructure, mobile handset, and Internet of Things (IOT) industries. Products include micro-transformers, RF circulators, couplers, baluns, power combiners/splitters, filters, IPD matching networks, phased array antennas and foundry services.

"3DGS is an OEM provider of glass-based devices and systems using their photo-structurable APEX Glass."

3DGS has created foundational patent positions related to all photo-sensitive glass-ceramic materials and devices. 3DGS owns the fundamental intellectual property (IP) for all four positions (materials, design, systems, and manufacturing) related to glass-ceramic devices for the electronics packaging industry. 3DGS leverages its unique product solutions providing device manufacturing and systems integration services for a number of standard and custom products.

With the ability to scale from thousands of units per month to tens of millions of units per month, 3DGS is a systems integration company here to show you a better way to move beyond tomorrow.